| Disco DFD 6340 Dicing Saw |
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| Disco Hi-Tec America, Inc. DFD6340 Fully Automatic Wafer Dicing Saw. Consisting of: Single chuck, Dual spindles, 4 blades gang spindle, H20 cleaning system (nozzle atomizer), Temp control unit for cutting/cleaning H2O, Surfactant tank w/ pump, Particulate filtration unit, Coin stack loading/unloading, and Vacuum unit. Dims 1180 D x 1110 W x 1850 H, Wgt 1600 kg. Also, Automatic Dicing Engine includes Server rack with Sonic firewalls, primary and secondary ignition servers, 10 KVA UPS, and 2 battery packs. Contents of 4 pallets and 1 speedpack. Pallet#s 001, 0053, 116, 173. Pallet Dim 1: 88X56X84. Dim 2: 56X41X38. Dim 3: 38X31X50. Dim 4: 51X35X47. Dim 5: 48X41X96. HIT# 2110800. Asset Located in Newark, CA. |
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