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Auction Calendar
Ending: June 1, 2010
On Behalf Of: Heetronix Corporation
Location: Reno, Nevada, USA
Public Preview Times:
On Site Preview of the facility will be held on May 31, 2010, from 9:00am to 5:00pm.
Key Assets:
Sealed bid lot #1, US 6,239,432 B1 IR Radiation Sensing With SiC
Sealed bid lot #2, US 6,576,972 B1 High Temperature Circuit Structures With Expansion Matched SiC
Sealed bid lot #3, US 6,649,994 B2 Temperature Sensing System With Matched Temperature Coefficients of Expansion
Sealed bid lot #4, US 6,713,762 B2 Acoustic Absorption Electromagnetic Radiation Sensing With SiC
Sealed bid lot #5, US 6,765,278 B2 Circuit Structure with W, WC and or W(2)C Layer on AlN Die
Sealed bid lot #6, US 6,765,278 B2 Circuit Structure with W, WC and or W(3)C Layer on AlN Die
Sealed bid lot #7, US 6,989,574 B2 High Temperature Circuit Structures With Thin Film Layer (2)
Sealed bid lot #8, US 6,995,691 B2 Bonded Structure Using Reacted Borosilicate Mixture.pdf
Sealed bid lot #9, US 7,106,167 B2 Stable High Temperature Sensor System With Tungsten on AIN
Sealed bid lot #10, US 7,176,461 B2 Acoustic Absorption Radiation Sensing in SiC
Sealed bid lot #11, US 7,190,250 B2 Encapsulation With Oxide Bond To Borosilicate Mixture
Sealed bid lot #12, US 7,224,256 B2 Stable High Temperature Heater With Serpentine Heating Strands on Insulate Substrate
Description:
By order of U.S. Bankruptcy Court Approval Case # NV-09-53112-LBR:
Sealed Bid Sale
Patents and Intellectual Properties of
Heetronix
Thin Film Silicon Carbide Radiation Sensor Manufacturer
Location:
725 Trademark Drive #104
Reno, Nv. 89521
Auctioneer's Note:
Heritage Global Partners is pleased to offer the patents of Heetronix Corp for sale by Sealed-Bid Auction. All bid submitted must be in full conformance with the Terms & Conditions of this auction. We encourage prospective bidders to conduct their due diligence and submit their bids no later than the Bid Submission Deadline. Please bear in mind that all bids should be submitted on a "best and final" basis, as there will be no subsequent overbid process nor any opportunity to raise your bids after the the Bid Submission Deadline.
Currency:
USD
Buyer's Premium: 18% / 15% (refer to term 7 in the Auction Terms and Conditions for details)
Contact:
For questions of either a scientific or technical nature please refer your questions to Jim Parsons of Heetronix. His email is jdp@heetronix.com
For questions regarding the Sealed-Bid Auction bidding process, please contact Doug Berman at dberman@hgpauction.com or 707-245-4417